Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TFBGA-64
External dimensions/packaging: TFBGA-64
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Mobile phone, mobile phone, video monitor
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA9989ET/C1,551
|
NXP | 类似代替 | TFBGA-64 |
IC HDMI TX 1.3A 150MHz 64-TFBGA
|
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