Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: PDIP
External dimensions/packaging: PDIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-9232501MXA
|
TI | 类似代替 | DIP |
2.4A , 55V H桥 2.4A, 55V H-Bridge
|
||
5962-9232501MXA
|
National Semiconductor | 类似代替 | DIP |
2.4A , 55V H桥 2.4A, 55V H-Bridge
|
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