Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
K7D803671B-HC33
|
Samsung | 功能相似 | BGA |
8Mbit SRAM 333MHz 153-BGA - K7D803671B-HC33
|
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