Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
DC Components | 功能相似 |
Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153
|
|||
6A8
|
Micro Commercial Components | 功能相似 | R-6 |
Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153
|
||
6A8
|
Good-Ark Electronics | 功能相似 | R-6 |
Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153
|
||
K7D803671B-HC30
|
Samsung | 功能相似 | BGA |
8Mbit SRAM 300MHz 153-BGA - K7D803671B-HC30
|
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