Technical parameters/Holding current (Max): 40 mA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-263-3
External dimensions/packaging: TO-263-3
Physical parameters/operating temperature: 125℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 功能相似 | D2PAK |
Bt137b-800 - 四象限三端双向可控硅
|
||
BT137B-800,118
|
We En Semiconductor | 功能相似 | TO-263-3 |
Bt137b-800 - 四象限三端双向可控硅
|
||
BT137B-800,118
|
NXP | 功能相似 | TO-263-3 |
Bt137b-800 - 四象限三端双向可控硅
|
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