Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: D2PAK
External dimensions/packaging: D2PAK
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BT137B-800G,118
|
NXP | 功能相似 | TO-263-3 |
Bt137b-800g - 四象限三端双向可控硅
|
||
BT137B-800G,118
|
We En Semiconductor | 功能相似 | TO-263-3 |
Bt137b-800g - 四象限三端双向可控硅
|
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