Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD4051BM96
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS CD4051BM96. 芯片, 模拟多路复用器/分离器, 8 X 1, SOIC-16
|
||
CD4052BE
|
HGSEMI | 功能相似 | DIP-16 |
TEXAS INSTRUMENTS CD4052BE 芯片, 多路复用器/信号分离器 4通道
|
||
CD4052BE
|
Intersil | 功能相似 | DIP |
TEXAS INSTRUMENTS CD4052BE 芯片, 多路复用器/信号分离器 4通道
|
||
CD4052BE
|
National Semiconductor | 功能相似 | DIP |
TEXAS INSTRUMENTS CD4052BE 芯片, 多路复用器/信号分离器 4通道
|
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