Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS74116AGX-10I
|
GSI | 功能相似 | TFBGA |
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 10MM, ROHS COMPLIANT, FBGA-48
|
||
GS74116AX-10IT
|
GSI | 功能相似 | TFBGA |
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 10MM, FBGA-48
|
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