Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS74116AGX-10I
|
GSI | 功能相似 | TFBGA |
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 10MM, ROHS COMPLIANT, FBGA-48
|
||
GS74116AX-10I
|
GSI | 功能相似 | FBGA |
SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 48Pin FBGA Tray
|
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