Technical parameters/number of circuits: 1
Technical parameters/access time: 5 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: BGA-144
External dimensions/length: 13 mm
External dimensions/width: 13 mm
External dimensions/height: 1.76 mm
External dimensions/packaging: BGA-144
External dimensions/thickness: 1.76 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 完全替代 | BGA-144 |
FIFO, 1KX36, 5ns, Synchronous, CMOS, PBGA144, 13 X 13MM, 1MM PITCH, PLASTIC, BGA-144
|
||
72V3640L7-5PFGI
|
Integrated Device Technology | 类似代替 | TQFP-128 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 36 128Pin TQFP
|
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