Technical parameters/access time: | 5 ns |
|
Technical parameters/power supply voltage: | 3.15V ~ 3.45V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 144 |
|
Encapsulation parameters/Encapsulation: | BGA-144 |
|
Dimensions/Length: | 13.0 mm |
|
Dimensions/Width: | 13.0 mm |
|
Dimensions/Packaging: | BGA-144 |
|
Dimensions/Thickness: | 1.76 mm |
|
Physical parameters/operating temperature: | 0℃ ~ 70℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 完全替代 | BGA-144 |
先进先出 3.3V 32K X 36 SSII
|
||
72V3640L7-5BB
|
Integrated Device Technology | 完全替代 | BGA-144 |
先进先出 3.3V 32K X 36 SSII
|
||
72V3640L7-5PFGI
|
Integrated Device Technology | 类似代替 | TQFP-128 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 36 128Pin TQFP
|
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