Package parameters/number of pins: 240
Encapsulation parameters/Encapsulation: PBGA-240
External dimensions/packaging: PBGA-240
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72T36135ML6BB
|
Integrated Device Technology | 功能相似 | BGA-240 |
FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 36 240Pin BGA
|
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