Technical parameters/access time: 12ns, 3.8ns
Technical parameters/power supply voltage: 2.375V ~ 2.625V
Technical parameters/power supply voltage (Max): 2.625 V
Technical parameters/power supply voltage (Min): 2.375 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 240
Encapsulation parameters/Encapsulation: BGA-240
External dimensions/length: 19 mm
External dimensions/width: 19 mm
External dimensions/height: 1.76 mm
External dimensions/packaging: BGA-240
External dimensions/thickness: 1.76 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72T36135ML6BB
|
Integrated Device Technology | 类似代替 | BGA-240 |
FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 36 240Pin BGA
|
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