Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71V416S10BEI
|
Integrated Device Technology | 功能相似 | TFBGA |
SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 48Pin CABGA
|
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