Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71V416S10BEGI
|
Integrated Device Technology | 功能相似 | TFBGA |
SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 48Pin CABGA Tube/Tray
|
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