Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.375V ~ 2.625V
Package parameters/number of pins: 119
Encapsulation parameters/Encapsulation: BGA-119
External dimensions/length: 14.0 mm
External dimensions/width: 22.0 mm
External dimensions/height: 1.55 mm
External dimensions/packaging: BGA-119
External dimensions/thickness: 2.15 mm
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71T75602S166BGI
|
Integrated Device Technology | 类似代替 | BGA-119 |
SRAM Chip Sync Single 2.5V 18M-Bit 512K x 36 3.5ns 119Pin BGA Tray
|
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