Technical parameters/access time: 3.5 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage: 2.375V ~ 2.625V
Technical parameters/power supply voltage (Max): 2.625 V
Technical parameters/power supply voltage (Min): 2.375 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 119
Encapsulation parameters/Encapsulation: BGA-119
External dimensions/length: 14 mm
External dimensions/width: 22 mm
External dimensions/height: 2.15 mm
External dimensions/packaging: BGA-119
External dimensions/thickness: 2.15 mm
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71T75602S166BGGI
|
Integrated Device Technology | 类似代替 | BGA-119 |
SRAM Chip Sync Single 2.5V 18M-bit 512K x 36 3.5ns 119Pin BGA Tray
|
||
71T75602S166BGI
|
Integrated Device Technology | 功能相似 | BGA-119 |
SRAM Chip Sync Single 2.5V 18M-Bit 512K x 36 3.5ns 119Pin BGA Tray
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review