Technical parameters/access time: 25 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Technical parameters/power supply voltage (Max): 3.45 V
Technical parameters/power supply voltage (Min): 3.15 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: CABGA-256
External dimensions/length: 17 mm
External dimensions/width: 17 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: CABGA-256
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70V3589S133BC8
|
Integrated Device Technology | 完全替代 | CABGA-256 |
静态随机存取存储器 64K X 36 3.3V SYNC DP RAM
|
||
70V3589S133DRG
|
Integrated Device Technology | 类似代替 | BFQFP-208 |
IC SRAM 2Mbit 133MHz 208QFP
|
||
70V3589S133DRG8
|
Integrated Device Technology | 类似代替 | BFQFP-208 |
Application Specific SRAM, 64KX36, 4.2ns, CMOS, PQFP208, 28 X 28MM, 3.5MM HEIGHT, GREEN, PLASTIC, QFP-208
|
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