Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 208
Encapsulation parameters/Encapsulation: BFQFP-208
External dimensions/length: 28.0 mm
External dimensions/width: 28.0 mm
External dimensions/packaging: BFQFP-208
External dimensions/thickness: 3.50 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70V3589S133BC8
|
Integrated Device Technology | 类似代替 | CABGA-256 |
静态随机存取存储器 64K X 36 3.3V SYNC DP RAM
|
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