Technical parameters/power supply current: 130 mA
Technical parameters/access time (Max): 55 ns
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: DIP
External dimensions/height: 4.19 mm
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ST Microelectronics | 功能相似 | WDIP |
UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.6INCH, CERAMIC, DIP-28
|
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|
|
ST Microelectronics | 功能相似 | WDIP |
UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.6INCH, CERAMIC, DIP-28
|
||
WS57C256F-55DMB
|
E2V | 功能相似 | DIP |
UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.6INCH, CERAMIC, DIP-28
|
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