Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM27H256-55/BXA
|
AMD | 功能相似 | WDIP |
UVPROM, 32KX8, 55ns, CMOS, CDIP28, CERAMIC, DIP-28
|
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