Technical parameters/frequency: 14GHz ~ 21GHz
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: Die
External dimensions/packaging: Die
Physical parameters/operating temperature: -55℃ ~ 85℃
Other/Product Lifecycle: End of Life
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HMC338
|
ADI | 功能相似 | CHIP |
Up/Down Conv Mixer 3 to 4V 33000MHz 4Pin DIE Gel Pack
|
||
HMC338LC3B
|
ADI | 功能相似 | QFN-12 |
RF-混频器-IC-通用-24GHz-~-34GHz-12-SMT(3x3)
|
||
HMC338LC3B
|
Hittite | 功能相似 | QFN-12 |
RF-混频器-IC-通用-24GHz-~-34GHz-12-SMT(3x3)
|
||
HMC339
|
ADI | 功能相似 | CHIP |
Up/Down Conv 3V to 4V 42000MHz 4Pin DIE Gel Pack
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review