Technical parameters/frequency: 26GHz ~ 33GHz
Technical parameters/power supply current: 28 mA
Technical parameters/dissipated power: 0.238 W
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 238 mW
Technical parameters/power supply voltage: 3V ~ 4V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: Chip
External dimensions/packaging: Chip
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Missiles and Precision Munitions, Aerospace and Defense
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 5A991.b
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HMC258
|
ADI | 功能相似 | DIE |
Up/Down Conv Mixer 20000MHz 4Pin DIE
|
||
HMC258
|
Hittite | 功能相似 |
Up/Down Conv Mixer 20000MHz 4Pin DIE
|
|||
HMC338LC3B
|
ADI | 功能相似 | QFN-12 |
RF-混频器-IC-通用-24GHz-~-34GHz-12-SMT(3x3)
|
||
HMC338LC3B
|
Hittite | 功能相似 | QFN-12 |
RF-混频器-IC-通用-24GHz-~-34GHz-12-SMT(3x3)
|
||
HMC339
|
ADI | 类似代替 | CHIP |
Up/Down Conv 3V to 4V 42000MHz 4Pin DIE Gel Pack
|
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