Technical parameters/dissipated power: 0.4 W
Technical parameters/breakdown voltage (collector emitter): 60 V
Technical parameters/minimum current amplification factor (hFE): 100 @150mA, 10V
Technical parameters/rated power (Max): 400 mW
Technical parameters/operating temperature (Max): 200 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 400 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: Flatpack-14
External dimensions/packaging: Flatpack-14
Physical parameters/materials: Silicon
Physical parameters/operating temperature: -65℃ ~ 200℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 类似代替 | FPAK |
Trans GP BJT PNP 60V 0.6A 14Pin FPAK
|
||
|
|
Semicoa Semiconductor | 完全替代 | 14 |
Trans GP BJT PNP 60V 0.6A 14Pin FPAK
|
||
|
|
Microsemi | 完全替代 | Flatpack-14 |
TRANS 4PNP 60V 0.6A
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