Technical parameters/dissipated power (Max): 6000 mW
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-39-3
External dimensions/packaging: TO-39-3
Physical parameters/materials: Silicon
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Semelab | 完全替代 | BCY |
Trans GP BJT NPN 80V 5A 3Pin TO-39
|
||
2N5336
|
Microsemi | 完全替代 | TO-39 |
Trans GP BJT NPN 80V 5A 3Pin TO-39
|
||
2N5336
|
NJS | 完全替代 |
Trans GP BJT NPN 80V 5A 3Pin TO-39
|
|||
2N5336
|
Central Semiconductor | 完全替代 | TO-39-3 |
Trans GP BJT NPN 80V 5A 3Pin TO-39
|
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