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Model IDT72T36135ML5BBG
Description 2.5V 18M - BIT HIGH -SPEED TeraSync FIFO 36Bit configuration 524288 × 36 2.5V 18M-BIT HIGH-SPEED TeraSync FIFO 36-BIT CONFIGURATION 524288 x 36
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Brand: Integrated Device Technology
Packaging BGA
Delivery time
Packaging method Tray
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(2814) Minimum order quantity(1)
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Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: BGA

External dimensions/packaging: BGA

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Customs information/ECCN code: EAR99

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
72T36135ML6BB 72T36135ML6BB Integrated Device Technology 功能相似 BGA-240
FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 36 240Pin BGA
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