Technical parameters/frequency: 14GHz ~ 20GHz
Technical parameters/power supply current: 50 mA
Technical parameters/dissipated power: 386 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 386 mW
Technical parameters/power supply voltage: 5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 7
Encapsulation parameters/Encapsulation: TQFN-6
External dimensions/packaging: TQFN-6
Other/Product Lifecycle: End of Life
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HMC338
|
ADI | 功能相似 | CHIP |
Up/Down Conv Mixer 3 to 4V 33000MHz 4Pin DIE Gel Pack
|
||
HMC338LC3B
|
ADI | 功能相似 | QFN-12 |
RF-混频器-IC-通用-24GHz-~-34GHz-12-SMT(3x3)
|
||
HMC338LC3B
|
Hittite | 功能相似 | QFN-12 |
RF-混频器-IC-通用-24GHz-~-34GHz-12-SMT(3x3)
|
||
HMC339
|
ADI | 功能相似 | CHIP |
Up/Down Conv 3V to 4V 42000MHz 4Pin DIE Gel Pack
|
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