Technical parameters/RAM size: 608256 b
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.15V ~ 1.25V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA-256
External dimensions/height: 1.05 mm
External dimensions/packaging: FBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 类似代替 | LBGA-256 |
IC FPGA 153 I/O 256FBGA
|
||
EP4CE22F17C6N
|
Altera | 类似代替 | FBGA-256 |
IC FPGA 153 I/O 256FBGA
|
||
EP4CE22F17C7
|
Altera | 完全替代 | FBGA-256 |
FPGA Cyclone IV E Family 22320 Cells 60nm Technology 1.2V 256Pin TFBGA
|
||
|
|
Intel | 类似代替 | LBGA-256 |
IC FPGA 153 I/O 256FBGA
|
||
EP4CE22F17C7N
|
Altera | 类似代替 | FBGA-256 |
IC FPGA 153 I/O 256FBGA
|
||
|
|
Intel | 类似代替 | LBGA-256 |
FPGA - 现场可编程门阵列 FPGA - Cyclone IV E 1395 LABs 153 IOs
|
||
EP4CE22F17I7
|
Altera | 类似代替 | FBGA-256 |
FPGA - 现场可编程门阵列 FPGA - Cyclone IV E 1395 LABs 153 IOs
|
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