Technical parameters/power supply voltage: 1.15V ~ 1.25V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA-256
External dimensions/packaging: FBGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | LBGA-256 |
FPGA - 现场可编程门阵列 FPGA - Cyclone IV E 1395 LABs 153 IOs
|
||
EP4CE22F17C6N
|
Altera | 完全替代 | FBGA-256 |
FPGA - 现场可编程门阵列 FPGA - Cyclone IV E 1395 LABs 153 IOs
|
||
|
|
Intel | 完全替代 | LBGA-256 |
FPGA - 现场可编程门阵列 FPGA - Cyclone IV E 1395 LABs 153 IOs
|
||
EP4CE22F17C7N
|
Altera | 完全替代 | FBGA-256 |
FPGA - 现场可编程门阵列 FPGA - Cyclone IV E 1395 LABs 153 IOs
|
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