Technical parameters/digits: 8
Technical parameters/access time (Max): 7 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.7V ~ 3.6V
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W25Q64FVSSIG
|
Winbond Electronics | 完全替代 | SOIC-8 |
64-Mbit(8M x 8bit),SPI接口,工作电压:2.7V to 3.6V
|
||
W25Q64JVSSIQ
|
Winbond Electronics | 类似代替 | SOIC-8 |
64M-bit/8M-byte FLASH芯片,SPI接口 133MHz(266/532MHz Dual/Quad-SPI) 比W25Q64FVSSIG更高速度
|
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