Technical parameters/operating voltage: | 2.7V ~ 3.6V |
|
Technical parameters/power supply current: | 20 mA |
|
Technical parameters/digits: | 8 |
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Technical parameters/access time (Max): | 7 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 2.7V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Height: | 1.8 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
|
Other/Product Lifecycle: | Obsolete |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W25Q64FVSSIG TR
|
Winbond Electronics | 完全替代 | SOIC-8 |
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 7ns 8Pin SOIC
|
||
W25Q64FVZEIG
|
Winbond Electronics | 完全替代 | WSON-8 |
Flash Serial-SPI 3V/3.3V 64Mbit 8M x 8Bit 8.5ns 8Pin WSON EP
|
||
W25Q64FVZPIG
|
Winbond Electronics | 完全替代 | WDFN-8 |
Flash Serial-SPI 3V 64Mbit 16M 1Bit 7ns 8Pin SOIC
|
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