Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 5.00 GΩ
Technical parameters/Contact resistance: 3.00 mΩ
Technical parameters/number of plug and unplug cycles: 500
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Other/Product Lifecycle: Unknown
Other/Manufacturing Applications: Communication and Networking, RF Communications, Industrial, Communications&Networking, Industrial, RF Communications
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
19-46-2-TGG
|
Multicomp | 完全替代 | Surface Mount |
MULTICOMP 19-46-2-TGG 射频/同轴连接器, SMA同轴, 直型隔板安装插座, 焊接, 50 ohm, 铍铜
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review