Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/Insulation resistance: | 5.00 GΩ |
|
Technical parameters/Contact resistance: | 3.00 mΩ |
|
Technical parameters/number of plug and unplug cycles: | 500 |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Physical parameters/contact material: | Beryllium Copper |
|
Physical parameters/insulation material: | Teflon |
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Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
19-46-1-TGG
|
Multicomp | 完全替代 |
MULTICOMP 19-46-1-TGG 射频/同轴连接器, SMA同轴, 直型插座, 焊接, 50 ohm, 铍铜
|
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