Technical parameters/dissipated power: 0.2 W
Technical parameters/forward current: 150 mA
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 200 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SOD-323
External dimensions/packaging: SOD-323
Physical parameters/operating temperature: 175℃ (TJ)
Other/Product Lifecycle: 0.2 µs
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 类似代替 | SOD-323 |
DIODE SILICON, PIN DIODE, PLASTIC, SC-76, 2Pin, PIN Diode
|
||
BAP64-03T/R
|
NXP | 类似代替 | SOD-323 |
SILICON, PIN DIODE, PLASTIC, SMD, SC-76, 2Pin
|
||
BAR64-03W
|
Infineon | 功能相似 | SOD-323 |
Silicon PIN Diode
|
||
|
|
M/A-Com | 功能相似 | SOT-23 |
Surface Mount Plastic PIN Diodes
|
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