Technical parameters/forward current (Max): 100 mA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SOD-323
External dimensions/packaging: SOD-323
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Wireless Communications, High Speed Data Networks
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BAP64-03,115
|
NXP | 功能相似 | SOD-323 |
NXP BAP64-03,115 二极管, 射频/PIN, 单, 0.7 ohm, 175 V, SOD-323, 2引脚, 0.35 pF
|
||
BAP64-03,115
|
Philips | 功能相似 | UMD |
NXP BAP64-03,115 二极管, 射频/PIN, 单, 0.7 ohm, 175 V, SOD-323, 2引脚, 0.35 pF
|
||
BAP65-03,115
|
NXP | 功能相似 | SOD-323 |
NXP BAP65-03,115 二极管, 射频/PIN, 单, 0.35 ohm, 30 V, SOD-323, 2引脚, 0.375 pF
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review