Technical parameters/number of contacts: 16
Technical parameters/Contact electroplating: Tin
Technical parameters/insulation resistance: 1000 MΩ
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Phosphor Bronze
Other/Product Lifecycle: Unknown
Other/Manufacturing Applications: Industrial, industry
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2014/06/16
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
110-93-316-41-001000
|
Mill-Max | 功能相似 | DIP |
MILL MAX 110-93-316-41-001000 芯片插座, DIP, 16脚, 通孔安装
|
||
SPC15498
|
Multicomp | 完全替代 |
MULTICOMP SPC15498 芯片插座, DIP, 触点数:16, 排距:0.3""
|
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