Technical parameters/number of contacts: 16
Technical parameters/Contact electroplating: Tin
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 7.62 mm
External dimensions/length: 20.3 mm
External dimensions/pin spacing: 7.62 mm
Physical parameters/contact material: Phosphor Bronze
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1-390261-4
|
Tyco Electronics | 类似代替 | DIP |
AMP FROM TE CONNECTIVITY 1-390261-4 芯片插座, DIP, 16路, 通孔安装
|
||
2227MC-16-03-09-F1
|
Multicomp | 完全替代 |
MULTICOMP 2227MC-16-03-09-F1 芯片和元件插座, 2227MC系列, DIP插座, 16 触点, 2.54 mm, 7.62 mm, 镀锡触芯
|
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