Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | LBGA-100 |
FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11MM, 1MM PITCH, BGA-100
|
||
|
|
Integrated Device Technology | 功能相似 | LBGA-100 |
FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11MM, 1MM PITCH, GREEN, BGA-100
|
||
72V263L6PFG
|
Integrated Device Technology | 功能相似 | TQFP-80 |
FIFO, 8KX18, 4ns, Synchronous, CMOS, PQFP80, GREEN, PLASTIC, TQFP-80
|
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