Technical parameters/number of circuits: 1
Technical parameters/access time: 4 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Technical parameters/power supply voltage (Max): 3.45 V
Technical parameters/power supply voltage (Min): 3.15 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 80
Encapsulation parameters/Encapsulation: TQFP-80
External dimensions/length: 14 mm
External dimensions/width: 14 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: TQFP-80
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 类似代替 | LBGA-100 |
FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11MM, 1MM PITCH, BGA-100
|
||
|
|
Integrated Device Technology | 类似代替 | LBGA-100 |
FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11MM, 1MM PITCH, GREEN, BGA-100
|
||
IDT72V263L6BC
|
Panasonic | 功能相似 |
3.3伏高密度SUPERSYNC窄总线FIFO 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO
|
|||
|
IDT72V263L6BC
|
Integrated Device Technology | 功能相似 | LBGA |
3.3伏高密度SUPERSYNC窄总线FIFO 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO
|
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