Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: PDIP
External dimensions/packaging: PDIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
VQ3001P
|
Vishay Siliconix | 功能相似 | CDIP |
MOSFET DUAL N & P CH 30V
|
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