Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM27S23DC
|
AMD | 功能相似 | DIP |
2048Bit (256X8) BIPOLAR PROM
|
||
JBP28L22MJ
|
TI | 功能相似 | CDIP |
标准和低功耗可编程只读存储器 STANDARD AND LOW POWER PROGRAMMABLE READ ONLY MEMORIES
|
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