Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM27S23PC
|
AMD | 功能相似 | DIP |
PROM Parallel 2Kbit 5V 20Pin PDIP
|
||
|
|
TI | 功能相似 | DIP |
(256 X 8) 2048Bit TTL PROM
|
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