Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT7202LA25PDG
|
Integrated Device Technology | 功能相似 | DIP |
FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.6INCH, GREEN, PLASTIC, DIP-28
|
||
|
|
Integrated Device Technology | 功能相似 | SOIC-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
||
IDT7202LA25TP
|
Integrated Device Technology | 功能相似 | DIP-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
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