Technical parameters/access time: | 25 ns |
|
Technical parameters/power supply voltage: | 4.5V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SOIC-28 |
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Dimensions/Packaging: | SOIC-28 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7202LA25P
|
Integrated Device Technology | 类似代替 | PDIP-28 |
FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.6INCH, PLASTIC, DIP-28
|
||
|
|
Integrated Device Technology | 完全替代 | SOIC-28 |
1K x 9 AsyncFIFO, 5V
|
||
|
|
Integrated Device Technology | 完全替代 | SOIC-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
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