Technical parameters/power supply voltage (Max): | 5.5 V |
|
Technical parameters/power supply voltage (Min): | 4.5 V |
|
Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SOIC-28 |
|
Dimensions/Length: | 17.9 mm |
|
Dimensions/Width: | 8.4 mm |
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Dimensions/Height: | 2.62 mm |
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Dimensions/Packaging: | SOIC-28 |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 完全替代 | SOIC-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
||
IDT7202LA25TP
|
Integrated Device Technology | 功能相似 | DIP-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
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