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Model IDT72V83L20PA
Description 3.3Voltage CMOS Dual Asynchronous FIFO DUAL 512 × 9, Dual 1024 × 9, Dual 2048 × 9, Dual 4096 × 9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9
Product QR code
Brand: Integrated Device Technology
Packaging TSSOP
Delivery time
Packaging method Tube
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1018) Minimum order quantity(1)
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Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 56

Encapsulation parameters/Encapsulation: TSSOP

External dimensions/packaging: TSSOP

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tube

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

Customs information/ECCN code: EAR99

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
7283L20PA8 7283L20PA8 Integrated Device Technology 功能相似 TFSOP-56
Ic Mem Fifo 2048x9 20ns 56-Tssop
PDF
72V83L20PA 72V83L20PA Renesas Electronics 功能相似 TSSOP-56
FIFO Mem Async Dual Depth/Width Bi-Dir 2K x 9 x 2 56Pin TSSOP Tube
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72V83L20PAGI 72V83L20PAGI Integrated Device Technology 功能相似 TFSOP-56
3.3伏的CMOS双异步FIFO DUAL 512× 9 ，双1024× 9双2048 ×9 ，双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
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