Technical parameters/access time: 20 ns
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TFSOP-56
External dimensions/length: 14.0 mm
External dimensions/width: 6.10 mm
External dimensions/packaging: TFSOP-56
External dimensions/thickness: 1.00 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7283L20PA8
|
Integrated Device Technology | 类似代替 | TFSOP-56 |
Ic Mem Fifo 2048x9 20ns 56-Tssop
|
||
72V83L20PA
|
Renesas Electronics | 完全替代 | TSSOP-56 |
FIFO Mem Async Dual Depth/Width Bi-Dir 2K x 9 x 2 56Pin TSSOP Tube
|
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