Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM27S13APC
|
AMD | 功能相似 | DIP |
OTP ROM, 512X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16
|
||
AM27S13DC
|
AMD | 功能相似 | DIP |
OTP ROM, 512X4, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16
|
||
DM74S571N
|
TI | 功能相似 | DIP |
512X4 OTPROM, 55ns, PDIP16, PLASTIC, DIP-16
|
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