Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
82S130/BEA
|
NXP | 功能相似 | DIP |
IC 512 X 4 OTPROM, 60ns, CDIP16, 0.3INCH, CERAMIC, DIP-16, Programmable ROM
|
||
AM27S13APC
|
AMD | 功能相似 | DIP |
OTP ROM, 512X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16
|
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