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Model M36W832BE70ZA6
Description SPECIALTY MEMORY CIRCUIT, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66
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Brand: ST Microelectronics
Packaging LFBGA
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Packaging method
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7899) Minimum order quantity(1)
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Encapsulation parameters/Encapsulation: LFBGA

External dimensions/packaging: LFBGA

Other/Product Lifecycle: Unknown

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
M36W216BI70ZA6 M36W216BI70ZA6 ST Microelectronics 功能相似 LFBGA
SPECIALTY MEMORY CIRCUIT, PBGA66, 12 X 8MM, 0.8MM PITCH, LFBGA-66
PDF
M36W432T85ZA6T M36W432T85ZA6T ST Microelectronics 功能相似 LFBGA-66
32兆位的2Mb X16 ，引导块闪存和4兆位256K x16的SRAM ，多重内存产品 32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256K x16 SRAM, Multiple Memory Product
RD38F1010C0ZTL0 RD38F1010C0ZTL0 Intel 功能相似 LFBGA
32Mbit, 3V advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns
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